Development of advanced SiC crystal growth, wafer fabrication and substrate polishing technologies at II-VI have been, and continue to be supported by a variety of Government programs. Development is focused on these critical enabling technologies and their transition to manufacturing, so as to assure a domestic source for current and next generation Department of Defense (DoD) system requirements. These requirements include critical high frequency and high power components with dramatically enhanced performance.

Current programs are being funded by: Past programs have been funded by:


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